Ali Keshavarzi
Dr. Keshavarzi is a technologist, a visionary, and a leader in high-tech semiconductor industry.
Senior Associate Director - USA
About us Ali
Ali Keshavarzi has enabled critical foundational technologies in microelectronics and computing that have delivered generations of low-power chips, microsystems, and integrated solutions to the semiconductor industry. He is currently an adjunct professor of electrical engineering at Stanford University. Dr. Keshavarzi returned to Stanford from DARPA Microsystems Technology Office (MTO) where he managed a large research portfolio as part of DARPA’s Electronics Resurgence Initiative (ERI). Prior to Stanford and DARPA, Dr. Keshavarzi was a Vice President of R&D and Technical Fellow at Cypress Semiconductor. Dr. Keshavarzi has had various senior R&D roles working with senior executives and technical fellows at Intel Corporation, TSMC, GlobalFoundaries, and in the industry. He is the founder of Leading Edge Research LLC in Los Altos, CA. Dr. Keshavarzi was also a visiting research scholar at UC Berkeley and was an advisor to DARPA before joining DARPA. He has worked with several startup companies to commercialize new products based on differentiated technology capabilities.
Dr. Keshavarzi is an IEEE Fellow. He has over 60 U.S. patents, over 70 peer reviewed papers, has received the best-paper award and the best-panel award at ISSCC and most paper citation awards from DAC and IEDM. He received the prestigious Intel Achievement Award (IAA). He is also distinguished as an Outstanding Electrical and Computer Engineer (OECE) of Purdue University.
Dr. Keshavarzi has been at the leading edge of research and technology development as a scientist, a researcher, a fellow, a thought leader, and a vice president in the areas of CMOS technology scaling, process technology, planar devices, FinFET transistors, circuits and design for low power chips, low voltage and high performance computing, low-power and programmable SoCs, wide-IO and high bandwidth memory, differentiated technologies based on embedded non-volatile memory (eNVM), advanced multi-chip fan-out, Systems embedded in Package (SeP), and 2.5D packaging with chiplets for heterogeneous integration of microsystems.