Every year, the IEEE ISSCC (International Solid State Circuits Conference) presents the cutting edge of IC design. It covers all the relevant application areas. As expected, AI is driving not just the processor market itself but also the corresponding data center technologies. It is here where the growth of the models is now putting stress on the data communication: >30% of the time is spend on moving data instead of computation. This bottleneck is becoming more severe. This is the reason to aggressively drive the application of optical communication to replace the copper wiring. Not only for communicating to rack but also from board to board. The latest developments now also focus on on-board large radix optical switches. With this increased focus on photonics-based solutions, related fields such as EDA also need to make further steps, specifically in the co-simulation of electrical and photonic sub-systems.
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The TD Shepherd team is happy to congratulate the Qualinx B.V. team on successfully raising €20 million from Dutch investors. TD Shepherd has provided strategic support to Qualinx over the years (starting in 2018), witnessing each step of their journey; their growth and success, makes us truly proud of their outstanding achievements.
If there’s one thing we’ve learned about surviving the Valley of Death in deep tech, it’s this: don’t go it alone. This stage is all about leveraging relationships, and corporate partnerships can be your most valuable lifeline. The key is to think beyond customers.
The so-called “Valley of Death” in deep tech isn’t just about running out of cash—it’s about navigating a period where expectations clash with reality. Investors want to see traction, but your tech isn’t market-ready. Customers are intrigued, but they’re not ready to commit. And your R&D costs? They’re still burning through cash like it’s a bonfire.